TOP269VG

instructions

TOPSwitch - JX in economic and efficient way to a 725 V power MOSFET, high voltage switch the current source, multi-mode PWM controller, oscillator, thermal shutoff protection circuit, fault protection circuit and other control circuit integrated within a single device.

The product features

EcoSmart - high efficiency and energy saving

• Within the scope of the whole load has high energy efficiency
• At 230 VAC input can achieve less than 70 mW of no-load power consumption
• In 230 VAC input when the input power of 1 W, standby power output up to 750 mW

Improve the design flexibility, reduce the system cost

• The multiple mode PWM control technology, which can fully improve the efficiency of all load conditions
• 132 kHz work frequency can reduce the size of the transformer and power supply
  • With 66 kHz frequency options, can meet the requirements of the highest efficiency
• Can realize precise flow programming
• The optimization of the line voltage feedforward inhibits line voltage ripple
• Frequency modulation technology to reduce the cost of EMI filter element
• Fully integrated soft start circuit reduces the device's start stress
• The rating of 725 V power MOSFET
  • Simplified design, easy to satisfy derating requirements

Comprehensive protection function

• Automatic restart can limit the output power during overload failure under 3%
  • Output short circuit protection (SCP)
  • Output overcurrent protection (OCP) composition among
  • Output overload protection (OPP)
• Output overvoltage protection (OVP)
  • Users can perform hysteresis/latch shut off programming
  • Simple and fast AC reset
  • Primary or secondary side
• Input voltage (UV) detection can prevent adverse fluctuations in shutdown when output
• Input overvoltage (OV) shut off to improve the tolerance of input surge
• Hysteresis value is bigger, can realize precise thermal shut off (OTP)

Advanced packaging options

• EDIP - 12 encapsulation:
  • Thin horizontal characteristics for ultra-thin design
  • Heat transfer to the PCB and heat sink
  • Can be mounted TO a heat sink, provide the equivalent of a TO - 220 encapsulation of thermal impedance
• ESIP - 7 c encapsulation:
  • Vertical characteristics can reduce PCB footprint size
  • By clamping piece fast installation radiator, provide the equivalent of a thermal impedance of the TO - 220 encapsulation
• The eSOP - 12 encapsulation:
  • General input, 66 W power output capacity
  • Ultra-thin SMT products suitable for ultra-thin design
  • By bare gasket and conducts heat source pins to the PCB
  • Support for wave soldering and reflow soldering